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Scribing and Cleaving Kits


Scribing and Cleaving Kit for Small Samples

Scribing and Cleaving Kit for Small Samples

Scribing and Cleaving Kit for Small Samples Includes: clear ruler with metric and imperial/US units, fine tipped sharpie for marking the sample , sample handling tweezers, pen style diamond scribe, and small sample pliers (GC-SS-100) for cleaving and a handy carrying case to keep all of the tools together. Good for thin and small samples.

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Marker-Scriber Kit

Marker-Scriber Kit

Diamond scribers for making fine marks and scribing the wafer surface. These diamond scribers also serve as replacements for those purchased in the starter kit. Three diamond scribers are included.

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The Cleaving Station-with mat

The Cleaving Station-with mat

The Cleaving Station has everything needed to scribe and cleaving using handheld tools. It has scribers for marking and weak point creation and pliers for full wafers and samples several mm wide. The handy box keeps everything together and the cleaving mat keeps the sample safe during the scribing and cleaving process and workspace clean.

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The Cleaving Station-without mat

The Cleaving Station-without mat

The Cleaving Station has everything needed to scribe and cleaving using handheld tools. It has scribers for marking and weak point creation and pliers for full wafers and samples several mm wide. The handy box keeps everything together.

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Cleaving Kit-with mat

Cleaving Kit-with mat

The complete tool set to scribe and cleave cleanly. This is a critical step to getting the best cross-sections or downsize wafers and pieces. The kit includes a large wafer mat, two diamond scribes for marking and scribing, one pen style diamond scribe and pliers for cleaving. This kit wide is suitable for a wide variety of substrates and wafers (Si, GaAs, glass).

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Cleaving kit- without mat

Cleaving kit- without mat

The complete tool set to scribe and cleave cleanly. This is a critical step to getting the best cross-sections. The kit includes two diamond scribes for marking and scribing, one pen style diamond scribe and pliers for cleaving. This kit wide is suitable for a wide variety of substrates and wafers (Si, GaAs, glass).

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scribers and cleavers

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