Scribing and Cleaving Kits
This kit includes: Small Sample Pliers, two rulers, an ultra fine tipped permanent marker, sample handling tweezers, a pen style diamond scribe, and a handy case to keep all of the tools together. These tools are for thin and small samples below 30 mm.
Our set of diamond scribers enable fine marks and scribes on the wafer surface. This step is critical in achieving an accurate cleave. Three diamond scribers are included: a pen style retractable scriber, a short handled straight scriber and a long handled 30° angled scriber.
The Cleaving Station with Large Mat includes all of the hand held tools needed to reduce a full wafer to samples a few millimeters in size. The station includes a variety of scribers to create weak point in the sample. Two pliers are included for a variety of sample sizes. A large self-healing mat is included to keep the workplace clean. A box is included to organize the workspace.
This kit contains the handheld tools needed to scribe and cleave wafers cleanly down to 30 mm samples. The diamond tipped scribers are used for a critical precleave scribe, for the most accurate cleave with the CleanBreak™ pliers. The kit includes a large self-healing mat and tools to assist in the cleaving process. The tools are suitable for a variety of materials including Si, GaAs, and glass.
This set includes hand held tools to scribe and cleave samples cleanly down to 30 mm. The three scribers have diamond tips, for a critical precleave scribe, necessary for an accurate cleave with the CleanBreak™ pliers. The kit includes additional tools which are helpful to achieve a clean sample. This kit is suitable for a wide variety of substrates and wafers (Si, GaAs, glass).