Scribing and Cleaving Kits
Scribing and Cleaving Kit for Small Samples
This kit includes: Small Sample Pliers, two rulers, an ultra fine tipped permanent marker, sample handling tweezers, a pen style diamond scribe, and a handy case to keep all of the tools together. These tools are for thin and small samples below 30 mm.
Our set of diamond scribers enable fine marks and scribes on the wafer surface. This step is critical in achieving an accurate cleave. Three diamond scribers are included: a pen style retractable scriber, a short handled straight scriber and a long handled 30° angled scriber.
The Cleaving Station-with large mat
The Cleaving Station with Large Mat includes all of the hand held tools needed to reduce a full wafer to samples a few millimeters in size. The station includes a variety of scribers to create weak point in the sample. Two pliers are included for a variety of sample sizes. A large self-healing mat is included to keep the workplace clean. A box is included to organize the workspace.
The Cleaving Station-without large mat
The Cleaving Station has everything needed to scribe and cleaving using handheld tools. It has scribers for marking and weak point creation and pliers for full wafers and samples several mm wide. The handy box keeps everything together.
Cleaving Kit-with large mat
This kit contains the handheld tools needed to scribe and cleave wafers cleanly down to 20 mm samples. The diamond tipped scribers are used for a critical precleave scribe, for the most accurate cleave with the CleanBreak™ pliers. The kit includes a large self-healing mat and tools to assist in the cleaving process. The tools are suitable for a variety of materials including Si, GaAs, and glass.
Cleaving kit- without large mat
This set includes hand held tools to scribe and cleave samples cleanly down to 20 mm. The three scribers have diamond tips, for a critical precleave scribe, necessary for an accurate cleave with the CleanBreak™ pliers. The kit includes additional tools which are helpful to achieve a clean sample. This kit is suitable for a wide variety of substrates and wafers (Si, GaAs, glass).
Carbide Cutter Cleaving Kit
Handheld tools for cutting and cleaving glass, silicon and hard materials. The carbide cutting wheels create a clean scribe line with minimizing of particles in comparison to pointed diamond scribe. Allows substrate to split cleanly. 5” Plastic handle. Includes 3 carbide cutters, 8” and 6” Cleanbreak Pliers for cleaving small and large samples, thick and thin, 12”x9”(300mmx226mm) cleaving mat, and 8”/200mm with metric and inches L-square ruler (for use as a straight edge measuring samples.