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Cleaving kit- without mat
Cleaving kit- without mat
Cleaving kit- without mat
SKU #:CSK-200-LG

Cleaving kit- without mat


For international orders call LatticeGear at +1-503-828-0040 or email us at


The complete tool set to scribe and cleave cleanly. This is a critical step to getting the best cross-sections. The kit includes two diamond scribes for marking and scribing, one pen style diamond scribe and pliers for cleaving, pliers for cleaving. This kit wide is suitable for a wide variety of substrates and wafers (Si, GaAs, glass).

The standard configuration includes one each:

1. Diamond Scribe-Pen style

2. Diamond Scribe-straight tip

3. Diamond Scribe- 30 degree tip

4. Tweezers with black soft fiber fine tip (length 6 ¼”)

5. CleanBreak Pliers-Wafer cleaving pliers.

6. Small ruler mat-Self healing, Small wafer piece ruler mat

7. Clear plastic ruler with metric and US units

8. Tungsten cleaving wire

scribers and cleavers

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