Cleaving kit- without mat
The complete tool set to scribe and cleave cleanly. This is a critical step to getting the best cross-sections. The kit includes two diamond scribes for marking and scribing, one pen style diamond scribe and pliers for cleaving, pliers for cleaving. This kit wide is suitable for a wide variety of substrates and wafers (Si, GaAs, glass).
The standard configuration includes one each:
1. Diamond Scribe-Pen style
2. Diamond Scribe-straight tip
3. Diamond Scribe- 30 degree tip
4. Tweezers with black soft fiber fine tip (length 6 ¼”)
5. CleanBreak Pliers-Wafer cleaving pliers.
6. Small ruler mat-Self healing, Small wafer piece ruler mat
7. Clear plastic ruler with metric and US units
8. Tungsten cleaving wire