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News and Events

Events and News

October 29 LatticeGear Sponsors Columbia Nano Day at the Columbia University’s Research Initiative in NanoTechnology (CNI)

LatticeGear sponsors Columbia Nano Day at the Columbia University’s Research Initiative in NanoTechnology (CNI). LatticeGear will have its scribing and cleaving portfolio available for live demo during lunch time noon to 2pm, come and see the novel technologies.   - https://cniindustryday2019.splashthat.com/

 

October 28 LatticeGear at Singh Center for Nanotechnology @ U PENN 2019 Annual User Meeting

LatticeGear sponsors Singh Center for Nanotechnology @ U PENN 2019 Annual User Meeting. LatticeGear will have its entire scribing and cleaving portfolio available for live demo. Come and see a paradigm shift in wafer downsizing, singulating and cross-section in the cleanroom -  https://www.eventbrite.com/e/singh-center-for-nanotechnology-2019-annual-user-meeting-registration-70650414291 

September 5 at MITnano

CLEAVING TECHNOLOGIES TO DOWNSIZING, SINGULATING AND CROSS-SECTIONING SUBSTRATES

9:30am–10:30am
12-0168, MIT.nano (basement level), Building 12
60 Vassar Street (rear)
Cambridge, MA

Register Now 

Substrate downsizing, singulating and cross-sectioning is a common practice for process development, experiments and analysis. Cleaving is the most desired technology to use as it is the only dry, clean, room temperature method that maintains all the parts without altering the process layers. The challenge with standard cleaving is the control and repeatability over quality and accuracy outcome. Therefore, we often resort to alternative methods, like dicing saw and FIB milling. LatticeGear focuses its entire product portfolio on cleaving technologies that challenges one assumptions about cleaving and scribing capabilities. The patented scribeless cleaving technology initiates the cleave with only microline indentation, no scribing and no particles, which makes it cleanroom compatible. The unique, patented scribing tool scribes on the backside to protect frontside features, ideal for clean, surface touchless downsizing. These technologies coupled with correct planning of the substrate preparation workflow based on the substrate characteristics and the outcome required enable downsizing and cross-sectioning for a variety of materials including glass, sapphire, III-V, SiC and silicon, and 300-mm wafer to 1-mm die. It even cleaves freestanding structures deposited by e-beam lithography and <100-µm thin substrate.

Join the workshop and learn how to handle your substrates successfully.

For more information contact, efrat.moyal@latticegear.com

August 21-22 at University of Glasgow, UK-China Emerging Technologies Conference

James Watt South (JWS) Building (Room 375)

PATENTED Backside Scribing - FlipScribe and PATENTED cleaving with no scribing – LatticeAx – Cleanroom compatible, will be demonstrated throughout the 2-days

We encourage you to bring your wafers and samples to try it out!

For more information contact, efrat.moyal@latticegear.com

August 21-22 at Molecular Foundry User Meeting , LBNL Berkeley, CA

Scribeless cleaving and backside scribing demos will be held during breaks and at the poster session, August 21, Building 54 Patio/cafeteria. LatticeGear is also happy to sponsor the session on Materials and Devices for Brain-Like Computing chaired by Alberto Salleo.

For more information contact, efrat.moyal@latticegear.com

Past Conferences 

August 4-8 at Microscopy and Microanalysis, Portland, Oregon

See a demonstration of the LatticeAx 420 and the surface touchless scribing tool FlipScribe 100 at the Electron Microscopy Sciences booth 938.

For more information contact, efrat.moyal@latticegear.com

July 19 at Stanford Nanofabrication Facility, CA

Live demos on scribeless cleaving. Friday July 19, 2019 from 10am-Noon

For more information contact, efrat.moyal@latticegear.com

July 9-11 at Semicon West in San Francisco, California

See a demonstration of the SCRIBELESS LatticeAx 120 cleaving machine for 300-mm wafer down to a single die and the surface touchless scribing tool - FlipScribe 100 at the Electron Microscopy Sciences booth #5977

For more information contact, efrat.moyal@latticegear.com

July 2-5 at IPFA Failure Analysis Conference in Hangzhou, China

Please plan to visit us there to learn more about our Cleaving Technologies and attend a LIVE DEMO!

For more information contact, efrat.moyal@latticegear.com

June 28-July 1 at ICLPT Laser at Photonics Technologies Conference in Xian, China

June 17-18 at ENRIS 2019 in Enschede, the Netherlands

we will be exhibiting our cleanroom-compatibleLatticeAx 120 and FlipScribe 100

For more information contact, efrat.moyal@latticegear.com

LatticeGear to Exhibit at the 2019 TechConnect World Innovation Conference June 17-18

See the LatticeAx and FlipScribe patented technologies in the innovation showcase Booth #38

To obtain a free exhibit pass contact:

LatticeGear LLC
lg@latticegear.com

September 21, 2018 - LatticeGear to Present and Exhibit at ESREF October 2-4, 2018

Do not miss, LatticeGear talk at the Industrial Session on Tuesday at 2:20pm: Scribing and CLEAVING SOLUTIONS in Nanofab and Research – technologies, workflows and uses cases.

See the LatticeAx and FlipScribe patented technologies in the Omni Booth #23

LatticeGear will demonstrate its patented technologies at ESREF 2018, Oct 2-4 in Aalborg, Denmark – Omni Booth #23: For general information about ESREF Click here

Contact Information:

LatticeGear LLC
lg@latticegear.com

August 20, 2018 - IMC19 - 19th International Microscopy Congress Sydney, Australia September 9-14, 2018

Visit LatticeGear- Booth 86 (Nano Technology Solutions)

At IMC19 see live of sample preparation demos on the LatticeAx cleaving system and the FlipScribe backside scriber. Both prepare glass, sapphire, III-V, SiC and silicon.. The LatticeAx integrates the indent and cleaving steps in a single tool and is cleanroom compatible, watch our latest video here. The FlipScribe scribes without  touching fragile frontside features, ideal for compound substrates and off-crystalline cleaving.

Contact Information:

LatticeGear LLC
lg@latticegear.com

August 17, 2018 - JSAP 2108, September 18-21, 2018, Nagoya Japan

Visit LatticeGear at Hisol booth

Demo our scribeless, cleanroom compatible LatticeAx® cleaving system and FlipScribe® ,the only, backside scriber.

DO NOT MISS, LatticeGear Luncheon Seminar:  The scribeless cleaving method for glass, sapphire, III-V, SiC and silicon will be presented. In addition, learn about the FlipScribe, surface touchless scribing tool to protect frontside features, ideal for compound substrates and off-crystalline cleaving. Cleanroom compatible.

Online Reservation Deadline : Noon on September 10 (Mon.), 2018 –REGISTER HERE

Contact Information:

LatticeGear LLC
lg@latticegear.com

June 27, 2017 - LatticeGear LLC Announces New Representation in China for Their Innovative Cleaving and Scribing Solutions for Electronics Failure Analysis and Materials Research

LatticeGear will introduce Hong Kong Guanghong International Co., Ltd. at the 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2017) in Chengdu, China, 4-7 July 2017.

Contact Information:

LatticeGear LLC
lg@latticegear.com

Michael Heng, Hong Kong Guanghong International Co., Ltd
hongkongguanghong@163.com

May 22, 2017 - LatticeGear Partners with NanoTechnology Solutions to offer cleaving and scribing solutions in Australia and New Zealand

LatticeGear, LLC. and NanoTechnology Solutions have announced a distribution agreement that brings LatticeGear’s innovative cleaving and scribing solutions to sample preparation workflows in electronics and materials research labs in Australia and New Zealand (ANZ).

Contact information:

NanoTechnology Solutions
https://nanotechnologysolutions.com.au/sample-preparation/
Inderpreet Gill
info@nt-s.com.au

LatticeGear, LLC.
https://latticegear.com/
lg@latticegear.com

 

 

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