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News and Events

News

June 17-18 at ENRIS 2019 in Enschede, the Netherlands

we will be exhibiting our cleanroom-compatibleLatticeAx 120 and FlipScribe 100

For more information contact, efrat.moyal@latticegear.com

LatticeGear to Exhibit at the 2019 TechConnect World Innovation Conference June 17-18

See the LatticeAx and FlipScribe patented technologies in the innovation showcase Booth #38

To obtain a free exhibit pass contact:

LatticeGear LLC
lg@latticegear.com

September 21, 2018 - LatticeGear to Present and Exhibit at ESREF October 2-4, 2018

Do not miss, LatticeGear talk at the Industrial Session on Tuesday at 2:20pm: Scribing and CLEAVING SOLUTIONS in Nanofab and Research – technologies, workflows and uses cases.

See the LatticeAx and FlipScribe patented technologies in the Omni Booth #23

LatticeGear will demonstrate its patented technologies at ESREF 2018, Oct 2-4 in Aalborg, Denmark – Omni Booth #23: For general information about ESREF Click here

Contact Information:

LatticeGear LLC
lg@latticegear.com

August 20, 2018 - IMC19 - 19th International Microscopy Congress Sydney, Australia September 9-14, 2018

Visit LatticeGear- Booth 86 (Nano Technology Solutions)

At IMC19 see live of sample preparation demos on the LatticeAx cleaving system and the FlipScribe backside scriber. Both prepare glass, sapphire, III-V, SiC and silicon.. The LatticeAx integrates the indent and cleaving steps in a single tool and is cleanroom compatible, watch our latest video here. The FlipScribe scribes without  touching fragile frontside features, ideal for compound substrates and off-crystalline cleaving.

Contact Information:

LatticeGear LLC
lg@latticegear.com

August 17, 2018 - JSAP 2108, September 18-21, 2018, Nagoya Japan

Visit LatticeGear at Hisol booth

Demo our scribeless, cleanroom compatible LatticeAx® cleaving system and FlipScribe® ,the only, backside scriber.

DO NOT MISS, LatticeGear Luncheon Seminar:  The scribeless cleaving method for glass, sapphire, III-V, SiC and silicon will be presented. In addition, learn about the FlipScribe, surface touchless scribing tool to protect frontside features, ideal for compound substrates and off-crystalline cleaving. Cleanroom compatible.

Online Reservation Deadline : Noon on September 10 (Mon.), 2018 –REGISTER HERE

Contact Information:

LatticeGear LLC
lg@latticegear.com

June 27, 2017 - LatticeGear LLC Announces New Representation in China for Their Innovative Cleaving and Scribing Solutions for Electronics Failure Analysis and Materials Research

LatticeGear will introduce Hong Kong Guanghong International Co., Ltd. at the 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2017) in Chengdu, China, 4-7 July 2017.

Contact Information:

LatticeGear LLC
lg@latticegear.com

Michael Heng, Hong Kong Guanghong International Co., Ltd
hongkongguanghong@163.com

May 22, 2017 - LatticeGear Partners with NanoTechnology Solutions to offer cleaving and scribing solutions in Australia and New Zealand

LatticeGear, LLC. and NanoTechnology Solutions have announced a distribution agreement that brings LatticeGear’s innovative cleaving and scribing solutions to sample preparation workflows in electronics and materials research labs in Australia and New Zealand (ANZ).

Contact information:

NanoTechnology Solutions
https://nanotechnologysolutions.com.au/sample-preparation/
Inderpreet Gill
info@nt-s.com.au

LatticeGear, LLC.
https://latticegear.com/
lg@latticegear.com

 


 

Events

July 18, 2017 - LatticeGear and NanoTechnology Solutions Partner to Present “Cleaving and Scribing Reinvented!”

How to select the best scribing and cleaving methods, workflows, accessories, and tools to cross-section and downsize your samples? Even glass, silicon and sapphire without saws, lasers or lubricants. Learn and See the LatticeAx, FlipScribe, small sample cleaver (SSC) and new accessories in action. This workshop and live demonstration is is offered at no cost. RSVP to: info@nt-s.com.au

 


 

Archive

August 31, 2016 - LatticeGear introduces the NEW LatticeAx 225

The NEW LatticeAx 225 integrates an ultra-stable indent and cleaving platform with the 120 base indent and cleaving system. This system is easy to operate and compact ( platform is 13″x11″). READ MORE

See LatticeGear at ESREF 2016 September 19-22,  Booth 18

The conference will take place at HÄNDEL-HALLE located in the immediate centre of Halle City (vis-à-vis Hallmarkt)

See LatticeGear at IPFA 2016 July 19-21 Booth A06

This year IPFA, 23rd International Symposium on the Physical Failure Analysis of Integrated Circuits is located in Singapore at the Marina Bay Sands Hotel. Visit LatticeGear Booth A06 for live demonstrations of the LatticeAx 420, FlipScribe, Small Sample Cleaver and more!

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