Cleaving Kit-with mat
The complete tool set to scribe and cleave cleanly. This is a critical step to getting the best cross-sections. The kit includes a large wafer mat, two diamond scribes for marking and scribing, one pen style diamond scribe and pliers for cleaving, pliers for cleaving. This kit wide is suitable for a wide variety of substrates and wafers (Si, GaAs, glass).
The standard configuration includes one each:
- Diamond Scribe-Pen style
- Diamond Scribe-straight tip
- Diamond Scribe- 30 degree tip
- Tweezers with black soft fiber fine tip (length 6 ¼”)
- CleanBreak Pliers-Wafer cleaving pliers.
- Large 18X12" Cutting Mat-Self healing, wafer cutting mat
- Small ruler mat-Self healing, Small wafer piece ruler mat
- Clear plastic ruler with metric and US units
- Tungsten cleaving wire