With a unique eight point diamond scribe tip, this precision scriber is the ultimate tool for hand scribing a wafer or sample pieces.
Our set of diamond scribers enable fine marks and scribes on the wafer surface. This step is critical in achieving an accurate cleave. Three diamond scribers are included: a pen style retractable scriber, a short handled straight scriber and a long handled 30° angled scriber.
Carbide cutter-General purpose
Best general-purpose tungsten carbide cutter for glass, silicon and other crystalline materials. Cuts thin glass 0.3-1.5 mm and hard glass 0.3-6mm.
High penetrating, tungsten carbide cutting wheel, enables non-slip start and deeper scoring. Cut glass 0.1-3 mm and hard glass 0.3-2mm. Trademarked Laser cutter excels at cutting thin glass, hard glass, quartz glass, silicon, III-V.
Carbide cutter-Laser-Ultra-thin glass
Tungsten carbide cutter with “laser” wheel for ultra-thin glass, .03-2 mm and hard glass 0.3-2mm and crystalline materials. High penetrating cutting, enables non-slip start and deeper scoring. This cutter excels at cutting ultrathin glass, hard glass, quartz glass, silicon, III-V.
Carbide Cutter-Deep cutting
Tungsten carbide cutter thick glass 3-10mm and silicon off crystal axis. Cutting wheel creates a clean scribe line while minimizing of particles in comparison to pointed diamond scribe. Allows substrate to split cleanly. 5" Plastic handle.