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Cleaving & Scribing Tool, LatticeAx, Flipscribe Systems, Glass & Sapphire Cleaving - LatticeGear

Handheld scribers


LatticeScriber

LatticeScriber

With a unique eight point diamond scribe tip, this precision scriber is the ultimate tool for hand scribing a wafer or sample pieces.

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Marker-Scriber Kit

Marker-Scriber Kit

Our set of diamond scribers enable fine marks and scribes on the wafer surface. This step is critical in achieving an accurate cleave. Three diamond scribers are included: a pen style retractable scriber, a short handled straight scriber and a long handled 30° angled scriber.

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Carbide cutter-General purpose

Carbide cutter-General purpose

Best general-purpose tungsten carbide cutter for glass, silicon and other crystalline materials. Cuts thin glass 0.3-1.5 mm and hard glass 0.3-6mm. 

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Carbide cutter-Laser

Carbide cutter-Laser

High penetrating, tungsten carbide cutting wheel, enables non-slip start and deeper scoring. Cut glass 0.1-3 mm and hard glass 0.3-2mm. Trademarked Laser cutter excels at cutting thin glass, hard glass, quartz glass, silicon, III-V.

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Carbide cutter-Laser-Ultra-thin glass

Carbide cutter-Laser-Ultra-thin glass

 Tungsten carbide cutter with “laser” wheel for ultra-thin glass, .03-2 mm and hard glass 0.3-2mm and crystalline materials.  High penetrating cutting, enables non-slip start and deeper scoring. This cutter excels at cutting ultrathin glass, hard glass, quartz glass, silicon, III-V.

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Carbide Cutter-Deep cutting

Carbide Cutter-Deep cutting

Tungsten carbide cutter thick glass 3-10mm and silicon off crystal axis. Cutting wheel creates a clean scribe line while minimizing of particles in comparison to pointed diamond scribe. Allows substrate to split cleanly. 5" Plastic handle.

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scribers and cleavers

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