Make sure you have everything to set up your cleaving workflow. This package includes 2 spare LatticeAx diamond indenters and everything necessary for cleaving large substrate, wafers and pieces.
Using simple mechanics, the small sample cleaver (SSC) uses a novel sample holder and a cleaving platform to safely cleave samples into chips as small as 2x2 mm.
The large sample and whole wafer cleaving accessory (LSPL) supports samples up to 300 mm during indenting and cleaving. The LSPL package includes the large sample support and the indenter position extender knob. The LSPL fits on all LatticeAx models.
The LatticeAx short diamond indenter is designed to make an indent approximately half the length of the standard diamond indenter (0.5mm). The LatticeAx short indent diamond indenter comes pre-aligned in the same shank as the standard indenter. There is no change in installation or handling procedures.