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I didn’t think it could be done but there are simple tools available to downsize tempered glass for quality control or failure analysis. With a custom scribing mechanism our FlexScribe can be used to downsize tempered glass for quality control or failure analysis. Read More….
Yale’s School of Engineering and Applied Physics (SEAS) will host their Cleanroom User Meeting on January 22, 2019. Share your experience with users, and vendors in the field. Hear Efrat Moyal talk about “Cleaving Science” and learn how to use the best methods and tools to prepare samples for processing and characterization. Get the inside scoop by downloading LatticeGear’s article on cleaving in the cleanroom!
Booth 220, Phoenix Convention Center October 30-31
The FlexScribe is LatticeGear’s latest sample preparation solution. It complements the patented FlipScribe® and LatticeAx® scribing and cleaving solutions.
The FlexScribe Station is a topside scriber, superfast, clean, simple station for downsizing by scribing. With a single platform, it scribes large samples up to 200 mm to samples down to 5 mm without restrictions on shape or thickness. Scribe a wide variety of crystalline and amorphous materials.
Do not miss, LatticeGear talk at the Industrial Session on Tuesday at 2:20pm: Scribing and CLEAVING SOLUTIONS in Nanofab and Research – technologies, workflows and uses cases.
LatticeGear will demonstrate its patented technologies at ESREF 2018, Oct 2-4 in Aalborg, Denmark – Omni Booth #23: For general information about ESREF Click here
Demo our scribeless, cleanroom compatible LatticeAx® cleaving system and FlipScribe® ,the only, backside scriber
Scribeless cleaving method for glass, sapphire, III-V, SiC and silicon. Surface touchless scribing tool to protect frontside features, ideal for compound substrates and off-crystalline cleaving. Cleanroom compatible.
Online Reservation Deadline : Noon on September 10 (Mon.), 2018 – https://meeting.jsap.or.jp/english/luncheon-seminars
At IMC19 see live of sample preparation demos on the LatticeAx cleaving system and the FlipScribe backside scriber. Both prepare glass, sapphire, III-V, SiC and silicon. The LatticeAx integrates the indent and cleaving steps in a single tool and is cleanroom compatible, watch our latest video here. The FlipScribe scribes without touching fragile frontside features, ideal for compound substrates and off-crystalline cleaving.
Contact Information:
LatticeGear LLC
lg@latticegear.com
Demo our scribeless, cleanroom compatible LatticeAx® cleaving system and FlipScribe® ,the only, backside scriber.
DO NOT MISS, LatticeGear Luncheon Seminar: The scribeless cleaving method for glass, sapphire, III-V, SiC and silicon will be presented. In addition, learn about the FlipScribe, surface touchless scribing tool to protect frontside features, ideal for compound substrates and off-crystalline cleaving. Cleanroom compatible.
Online Reservation Deadline : Noon on September 10 (Mon.), 2018 –REGISTER HERE
Contact Information:
LatticeGear LLC
lg@latticegear.com
Hey FlipScribe users? Watch this short movie to see the new holder we have developed for the FlipScribe. It grips samples from 5-25mm and can be used as a holder to grab the sample prior to cleaving. Contact us at lg@latticegear.com to get your new holder.
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