LatticeGear gear has become the leading name in the wafer dicing industry with our novel and fresh approach to developing our own benchtop tools. Suitable for any laboratory or cleanroom, these tools are a far cry from it’s previous counterparts which consisted of large, expensive and cumbersome pieces of machinery.

Take advantage of the latest in wafer dicing machinery

If you’re looking for the most advanced technology in wafer dicing equipment then you’ve come to the right place. LatticeGear has developed a wide range of tools that will guarantee you the most powerful and precise cuts. The experts at LatticeGear fully understand that scribe angle, depth and the crystalline structure of the material play a major role in the accuracy of the cleave.

Scribing tools and wafer cleaving technology for premium precision at budget friendly prices

Are you looking for high quality, reliable and affordable scribing tools that won’t let you down when you need them the most? At LatticeGear we understand the importance of precision when it comes to creating specialized hardware, or scientific equipment. Choose from our wide range of scribing tools including Flexscribe, LatticeScriber and Carbide Cutters for quality you can trust. These tools are simple to use while guaranteeing you excellent results every time.

Why choose LatticeGear for your wafer dicing equipment, scribing tool and wafer cleaving?

LatticeGear had been in operation since its booming beginnings in 2012. The brilliant minds behind the business recognized a gap in the market that needed to be filled. No longer did scientists and researchers have to choose between manual hand operated tools or large expensive pieces of equipment to carry out their operations. Call the friendly team at LatticeGear on 503-828-0040 for all your queries and to book an appointment to find your perfect wafer cleaving and wafer dicing equipment today.

Well aware that the best scribing tools and wafer cleaving methods are steered by substrate hardness and thickness, LatticeGear founder Janet Teshima knows that cleave quality is heavily dependent on scribe angle and depth, as well as the underlying crystal structure.

That’s why LatticeGear’s sample preparation solutions focus on streamlining workflows while ensuring high levels of accuracy, particularly for unique samples where the risk of destruction is unacceptable.

Affordable scribing tools streamline accurate wafer cleaving and dicing processes

Prompted by the concept that preparing samples through scribing tools and wafer cleaving should be dry and clean, LatticeGear developed cost-effective technologies (like scribing and cleaving tools) that ensure fast and easy scribing and cleaving processes with no need for massive investments in specialized equipment.

Its flagship tools are:

• LatticeAx series (120, 225 and 420): designed mainly for use in cleanrooms and nanofabs, these patented cleaving platforms ensure accurate, repeatable results;
• FlipScribe 100: scribing on the back of a substrate is an effective scribing option, particularly for glass, sapphire and bonded wafers;
• FlexScribe: designed for a variety of materials ranging from sapphire to silicon, this tungsten carbide cutter can also handle glass and III-V compounds;
• LatticeScriber: its unique eight-point diamond tip ensures high accuracy for hand-scribed projects.

Special attention to one of a kind samples

Particularly when working with irregular or very small wafers, researchers, engineers and technicians need high precision and repeatable processes. Usually subject to tight schedules, speedy processing and rapid throughput are added advantages, but with no loss of accuracy or sample quality.

Creative solutions from LatticeGear

No matter how complex your project, LatticeGear can weave state-of-the-art cleaving and scribing tools into creative solutions that won’t break even the tightest budgets. Just tell us what you need, and the highly-qualified team led by founder Janet Teshima who will quickly outline customized responses for high-precision projects. Give us a call today at (503) 828-0040.

As devices get slimmer and faster with each new launch, chip manufacturers are under pressure to produce smaller but more powerful components. With transistor density doubling every couple of years, LatticeGear is well aware that high-precision wafer cleaving tools are needed to keep pace with surging technology.

Innovative wafer cleaving tools boost accuracy

Working closely with research institutions and industrial laboratories handling steady throughflows of samples, LatticeGear’s benchtop wafer cleaving tools serve as innovative springboards for technological leaps. As an example, its Small Sample Cleaver can work securely to dice chips as tiny as 2×2 mm.

Other products include scribing and cleaving stations, as well as handheld tools. But clean cleaves depend heavily on scribing quality, and handheld equipment might not always produce a top-quality cleave. Worse still, the direction in which a cleave propagates cannot always be properly controlled.

Wide range of wafer cleaving tools ensures accuracy, every time

This is where scribing and cleaving tools designed by LatticeGear are worth their weight in gold. Its two flagship products are LatticeAx and Flipscribe. Using dry processes at room temperature, both these tools offer clean (and repeatable) wafer downsizing methods. Their advantages include:

• more accurate results at lower costs, for faster, more efficient product development;
• fewer damaged samples and repeated experiments, stretching tight R&D funding;
• less particulate contamination and scrap, for cleaner samples and budget-compliant projects.

Creative solutions from LatticeGear

Streamlining sample preparation for close on a decade, LatticeGear is on the cutting edge of cleanroom-compatible scribing and cleaving tools and technologies. With a solid science background, its founder Janet Teshima is well equipped to design innovative solutions for even the trickiest scribing and cleaving requirements. Give LatticeGear a call today at (503) 828-0040, and we’ll be glad to explore innovative ways of scribing and cleaving your samples.

During almost a decade of ground-breaking work in the semiconductor field, LatticeGear developed an innovative line of benchtop tools. Cleanroom compatible, they are designed to handle a broad range of amorphous and crystalline substrates, including:

• Glass: thick, thin, fused quartz and tempered;
• Sapphire: used when optical transmission is required in the ultraviolet (above 200 nm) or infrared (below 5 μm) ranges;
• Silicon: the most common material, widely used for high-tech purposes, particularly integrated circuits;
• Gallium Arsenide (GaAs): used to fabricate integrated circuits, laser diodes, solar cells, and infrared light-emitting diodes,
• Indium Phosphide (InP): widely used for high-speed fiber-optic communications, with electron velocity outstripping most other semiconductors.

Innovative wafer dicing machines respond to high-tech needs

On the relatively new semiconductor market, scribing tools and wafer cleaving solutions must be flexible and open to customization, while also ensuring replicability. Bridging the gap between low-cost but inaccurate manual cleaving methods and expensive but slow automated workflows, the benchtop tools developed by LatticeGear speed up imaging and analysis procedures without breaking the bank.

When working with one-of-a-kind specimens that require special care, wafer dicing equipment designed by LatticeGear is a prudent choice. In the integrated circuit world, these functional circuits are fabricated on blocks of semiconducting materials, which are then fed into high-precision wafer dicing machines. Each wafer is diced or cut into smaller pieces (called dies), each of which contains a copy of the circuit.

More than just a niche business

Keeping pace with fast-moving semiconductor technology for almost a decade, LatticeGear stays in close touch with the world outside its labs. A certified Minority Business Enterprise (MBE), Emerging Small Business (ESB) and Women Business Enterprise (WBE), it is well-equipped to think outside the box.

This leads to creative solutions that deploy its innovative wafer dicing equipment, scribing tools, and wafer cleaving processes that uphold high levels of precision in budget-friendly configurations. Give us a call to explore new approaches to sample processing flows: (503) 828-0040.