Call us at MIT’s Jaramillo group is integrating LatticeGear solutions into their wafer/sample preparation workflow for controlled, damage-free wafer downsizing that is critical to their device fabrication process. Hillsboro, OR; October 15, 2019. The Jaramillo Group at the Massachusetts Institute of Technology has adopted LatticeGear’s complete scribing and cleaving tool portfolio in support of their research on photonic […]
Monthly Archives: October 2019
Yale Adds New Scribing and Cleaving Solutions to Downsize Wafers and Singulate Devices in the University Cleanroom
For Immediate Release Dr. Yong Sun – Cleanroom Director Department of Applied Physics, Yale University https://www.eng.yale.edu/cleanroom/ yong.sun@yale.edu Efrat Moyal, Co-Founder LatticeGear, LLC. Efrat.moyal@latticegear.com Yale Adds New Scribing and Cleaving Solutions to Downsize Wafers and Singulate Devices in the University Cleanroom Implementing the full suite of LatticeGear solutions in the University Cleanroom allowed researchers to […]